Masked spacer etching for imagers

ABSTRACT

The invention relates to a dual masked spacer etch for improved dark current performance in imagers. After deposition of spacer material such as oxide, N-channel regions are first opened for N +  source/drain implant and P-channel regions are then opened for P +  source/drain implant. Prior to the N +  source/drain implant, the wafer receives a patterned first spacer etch. During this first spacer etch, the photosensor region is covered with resist. Prior to the P +  source/drain implant, a masked second spacer etch is performed. Again the photosensor region is protected with photoresist. In such a manner, spacers are formed on the gates of both the N-channel and P-channel transistors but in the photodiode region the spacer insulator remains.

FIELD OF THE INVENTION

The present invention relates to production of spacers next to gates insemiconductor devices. For example, a CMOS imager may have spacers nextto gates of N-channel devices within an array and also next to gates ofP-channel devices at the array's periphery.

BACKGROUND OF THE INVENTION

There are a number of different types of semiconductor-based imagers,including charge coupled devices (CCDs), photodiode arrays, chargeinjection devices and hybrid focal plane arrays. CCDs are often employedfor image acquisition for small size imaging applications. CCDs are alsocapable of large formats with small pixel size and they employ low noisecharge domain processing techniques. However, CCD imagers have a numberof disadvantages. For example, they are susceptible to radiation damage,they exhibit destructive read out over time, they require good lightshielding to avoid image smear and they have a high power dissipationfor large arrays.

Because of the inherent limitations in CCD technology, there is aninterest in complementary metal oxide semiconductor (CMOS) imagers forpossible use as low cost imaging devices. A fully compatible CMOS sensortechnology enabling a higher level of integration of an image array withassociated processing circuits would be beneficial to many digitalapplications such as, for example, in cameras, scanners, machine visionsystems, vehicle navigation systems, video telephones, computer inputdevices, surveillance systems, auto focus systems, star trackers, motiondetection systems, image stabilization systems and data compressionsystems for high-definition television.

A CMOS imager circuit includes a focal plane array of pixel cells, eachone of the cells including either a photodiode, a photogate or aphotoconductor overlying a doped region of a substrate for accumulatingphoto-generated charge in the underlying portion of the substrate.

In a conventional CMOS imager, the active elements of a pixel cellperform the necessary functions of: (1) photon to charge conversion; (2)accumulation of image charge; (3) transfer of charge to a floatingdiffusion node accompanied by charge amplification; (4) resetting thefloating diffusion node to a known state before the transfer of chargeto it; (5) selection of a pixel for readout; and (6) output andamplification of a signal representing pixel charge. The charge at thefloating diffusion node is typically converted to a pixel output voltageby a source follower output transistor. The photosensitive element of aCMOS imager pixel is typically either a depleted p-n junction photodiodeor a field induced depletion region beneath a photogate. Forphotodiodes, image lag can be eliminated by completely depleting thephotodiode upon readout.

CMOS image sensors of the type discussed above are generally known asdiscussed, for example, in Nixon et al., “256.times.256 CMOS ActivePixel Sensor Camera-on-a-Chip,” IEEE Journal of Solid-State Circuits,Vol. 31(12), pp. 2046-2050 (1996); and Mendis et al., “CMOS Active PixelImage Sensors,” IEEE Transactions on Electron Devices, Vol. 41(3), pp.452-453 (1994). See also U.S. Pat. Nos. 6,177,333 and 6,204,524 whichdescribe operation of conventional CMOS imagers, the contents of whichare incorporated herein by reference.

CMOS imagers have a number of advantages, including for example lowvoltage operation and low power consumption. CMOS imagers are alsocompatible with integrated on-chip electronics (control logic andtiming, image processing, and signal conditioning such as A/Dconversion); CMOS imagers allow random access to the image data; andCMOS imagers have lower fabrication costs as compared with theconventional CCD since standard CMOS processing techniques can be used.Additionally, low power consumption is achieved for CMOS imagers becauseonly one row of pixels at a time needs to be active during readout andthere is no charge transfer (and associated switching) from pixel topixel during image acquisition. On-chip integration of electronics isparticularly advantageous because of the potential to perform manysignal conditioning functions in the digital domain (versus analogsignal processing) as well as to achieve a reduction in system size andcost.

Many conventional imagers have a photosensitive element formed justbelow a semiconductor substrate's surface at which circuitry is alsoformed. In a CMOS imager, for example, each pixel's photosensitiveelement typically includes a suitably doped region of semiconductorsubstrate, while the pixel's circuitry includes N-channel devices withgates on the substrate surface. At the periphery of the pixel array,circuitry for image readout and processing typically includes N-channeland P-channel devices with gates also on the substrate's surface.

Both the N-channel and the P-channel gates typically have insulatingspacers at their sides, and the spacers act as masks for subsequentoperations such as doping. The insulating spacers can be oxide, nitride,or an oxide/nitride sandwich structure. Conventionally, a single blanketspacer etch concurrently forms the spacers for the N-channel andP-channel devices by patterning an oxide layer. This etch removes theinsulating layer from the photosensitive element and leaves thephotosensitive element exposed to subsequent processes.

Photosensitive elements of CMOS imagers and other imagers aresusceptible to various known defects, such as excessive dark current orother leakage and parasitic effects, crosstalk between pixels, andothers. It would be advantageous to have improved methods forfabricating imaging devices, to reduce the risk of damage or defects inimager photosensitive elements. It would also be advantageous to haveimagers that avoid such risks of damage or defects.

SUMMARY OF THE INVENTION

The invention provides techniques for performing masked spacer etches onimagers. The techniques allow protection of photosensitive elements. Anexemplary embodiment of the invention provides an imager produced by adual masked spacer etch after an insulating layer is deposited overphotosensitive elements, gates of N-channel devices, and gates ofP-channel devices. The imager includes N-channel regions with N⁺source/drain implant and P-channel regions with P⁺ source/drain implant.Prior to N⁺ source/drain implant, a first masked spacer etch exposesregions for doping. During this first masked spacer etch, thephotosensor region is covered with resist. Prior to the P⁺ source/drainimplant, a second masked spacer etch exposes regions for doping. Againthe photosensor region is protected with photoresist. In such a manner,spacers are formed on gates of both the N-channel and P-channel devices,but in photosensor regions, the spacer insulator remains.

The techniques can protect photosensitive elements, and therefore reducedark current and other defects that could occur if the photosensitiveelements were unprotected.

These and other features and advantages of the invention will be moreapparent from the following detailed description that is provided inconnection with the accompanying drawings illustrating exemplaryembodiments of the invention.

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1 is a plan view of portions of a CMOS imager integrated circuit(IC) according to an exemplary embodiment of the invention.

FIGS. 2-7 are a series of schematic cross-sectional views along line A-Ain FIG. 1 showing stages in production of an IC with a dual maskedspacer etch.

FIG. 8 is a schematic cross-sectional view showing a completed stage ofproduction of an IC with patterned contacts and a dual masked spaceretch.

FIG. 9 illustrates a block diagram of a CMOS imager device having apixel array, wherein the imager device may be combined with a processorin a single integrated circuit fabricated according to the presentinvention.

DETAILED DESCRIPTION OF THE INVENTION

In the following detailed description, reference is made to variousspecific embodiments in which the invention may be practiced. Theseembodiments are described with sufficient detail to enable those skilledin the art to practice the invention, and it is to be understood thatother embodiments may be employed, and that structural and logicalchanges may be made without departing from the spirit or scope of thepresent invention.

As used herein in the description of the invention, the N and Pdesignations are used in the common manner to designate donor andacceptor type impurities which promote electron and hole type carriersrespectively as the majority carriers. The “+” symbol, when used as asuffix with an impurity type should be interpreted to mean that thedoping concentration of that impurity is heavier than the dopingassociated with just the letter identifying the impurity type withoutthe “+” suffix.

The terms “substrate” and “wafer” can be used interchangeably in thefollowing description and may include any semiconductor-based structure.The structure should be understood to include any of silicon, silicon-oninsulator (SOI), silicon-on-sapphire (SOS), doped and undopedsemiconductors, epitaxial layers of silicon supported by a basesemiconductor foundation, and other semiconductor structures. Thesemiconductor need not be silicon-based. The semiconductor could besilicon-germanium, germanium, or gallium arsenide. When reference ismade to the substrate in the following description, previous processsteps may have been utilized to form regions or junctions in or over thebase semiconductor or foundation.

The term “metal” is intended to include not only elemental metal, butcan include metal with other trace metals or in alloyed combinationswith other metals as known in the semiconductor art, as long as suchalloy retains the physical and chemical properties of a metal. The term“metal” also includes conductive oxides of such metals.

In FIGS. 1-9, like reference numbers designate like elements. FIG. 1illustrates features of an imager integrated circuit (“IC”) in which thesame material is in spacers along gates of N-channel and P-channeldevices and also covers a photosensitive region. FIGS. 2-8 illustrate anexemplary embodiment of the invention using a dual masked spacer etch toproduce an IC as in FIG. 1. N-channel regions of the imager device arefirst patterned for N⁺ source/drain implant, followed by patterning ofP-channel regions and opening for P⁺ source/drain implant. The order ofmasked spacer etch including source/drain implant is notcritical to thisinvention. While N⁺ source/drain regions may be formed prior to P⁺source/drain regions, this order can be reversed.

In FIG. 1, portions of 58 and 59 of semiconductor substrate 70 areillustrated at a surface of which a CMOS imager integrated circuit (IC)may be fabricated. The CMOS fabrication process may begin with alightly-doped P-type or N-type silicon substrate, for example, orlightly-doped epitaxial silicon on a heavily doped substrate. Portion 58of substrate 70 includes components of a pixel cell's circuitry withinan array of pixels, while portion 59 includes representative componentsformed at the periphery of the array, such as for timing and control orreadout of signals from pixel cells.

FIG. 1 shows that spacer material 88 is present in spacers 105 forN-channel devices in portions 58 and 59, in spacers 114 for P-channeldevices in portion 59, and also photodiode 90. Spacer material 88 coversphotodiode 90 because spacers 105 and 114 are formed by masked spaceretching rather than by a blanket spacer etch.

In CMOS imager applications, procedures that involve a blanket spaceretch often give rise to problems during processing. As a result of ablanket spacer etch, for example, the photodiode region is often subjectto damage. A blanket spacer etch can cause spacer over-etch damage tothe photodiode, and bare silicon exposed in the photodiode region can beexposed to heavy metal impurities during resist strip, ion implantation,or subsequent cleaning steps. Such problems can often result in anincrease in photodiode dark current. Spacer material 88 over photodiode90 can therefore alleviate photodiode dark current.

One form of dark current is generation current at a photodiode node,which can modify pixel stored charge in a random manner and reduceimaging quality. Dark current in a CMOS imager depends on the devicegeometry and shape, i.e., corners within the photodiode, their angle andnumber. As such, the dimensions, i.e. geometry and shape, and numbers ofphotodiodes and transistor devices described in relation to FIG. 1 andother exemplary embodiments of the invention are only illustrative andmay be independently increased or decreased to further improve darkcurrent.

CMOS dark current magnitude is also affected by the photodiode areajunction (current depending on doping concentrations, bandgap andtemperature of a reversed biased diode), and leakage current due to theactive area shape. Dark current can also arise in the electricalconnection region along the sidewalls of trench isolation regions.Various measures can be taken to alleviate these sources.

The technique of FIG. 1 has proven particularly effective in reducingdark current in a CMOS imager, and is beneficial because it reducesphotosensor dark current during image acquisition, while maintaining theimage processing and imaging capabilities of CMOS chip devices.

FIGS. 2-8 show cross-sections during production of circuitry at thesurface of substrate 70 to obtain the components shown in FIG. 1. Thebreak symbol (\\) in FIGS. 2 through 7 represents a spatial separationbetween the array with N-channel transistors and the periphery withN-channel transistors and P-channel transistors.

FIG. 2 depicts the FIG. 1 device after gate stack patterning, but priorto a dual masked spacer etch. For exemplary purposes, the substrate 70may be a silicon substrate. However, as noted above, the invention hasequal application to other semiconductor substrates.

As shown in FIGS. 1 and 2, portion 58 includes photodiode 90 formedwithin the substrate 70. Photodiode 90 functions as a photosensor.Photodiode 90 may, for example, include a photosensitive p-n-p junctionregion formed at or beneath the upper surface of substrate 70 byconventional techniques.

Portion 58 also includes N-channel transistors controlled by transfergate 76 and reset gate 84, each formed by first depositing and thenpatterning a gate stack 72. Gate stack 72 can be formed, for example, byfirst depositing and then patterning a layer of gate oxide 61, forexample a grown or deposited silicon dioxide or a high K insulator, aconductive layer 62 for example doped polysilicon, or a metal, asilicide or a combination of these, and an insulating layer 63 forexample oxide or nitride or a combination of these.

Transfer gate 76 transfers photoelectric charges generated in photodiode90 to a floating diffusion region 200 acting as a sensing node. Resetgate 84 resets the floating diffusion sensing node. The gates may beformed as stacked gates that include an insulating layer 63 over anelectrode layer 62 formed over a gate oxide layer 61.

In one embodiment, a layer of gate oxide 61 is formed over the surfaceof substrate 70. A layer of doped polysilicon 62 is then formed overgate oxide layer 61. An insulating layer 63 is then deposited over thelayer of doped polysilicon 62. Layers 61, 62 and 63 may be deposited byany suitable technique, including chemical vapor deposition (CVD)techniques such as low pressure chemical vapor deposition (LPCVD) orhigh density plasma (HDP) deposition. Gate oxide layer 61 is typically agrown oxide. Photoresist layer 74 is then deposited and patterned. Gates76 and 84 are then formed by etching exposed portions of layers 61, 62and 63. P-channel gates 94 and N-channel gates 294 are formed in theperiphery in a similar manner. The order of the process steps for gateformation may be varied as is required or convenient for a particularprocess flow. For example, the gate stacks may be formed before, orafter, or between steps that form a photogate sensor.

After gate patterning shown in FIG. 2, photoresist layer 74 is removedusing an oxygen containing plasma process. After stripping photoresist74 from over gates 76, 84, 94 and 294, doping operations such as P-Wellimplants, N-Well implants, transistor n- and p-implants, photodioden-type implants, angled diode implants, and other angled implants may beperformed with appropriate photoresist masks, which are also stripped.Trench isolation regions 55 may be formed by an STI process, a LocalOxidation of Silicon (LOCOS) process, or other suitable process. Asshown in FIG. 3, transistor n-type implants, for example N-channellightly doped drain (LDD) implant 83, may be formed in P-Well 85 in thearray. Transistor p-type implants, for example P-channel pLDD implant93, may be formed in N-Well 95 in the periphery. Then, a layer of spaceroxide 88 is deposited over gates 76 and 84 in the array, and over gates94 and 294 in the periphery.

As shown in FIG. 3, spacer insulator 88 is deposited on substrate 70 aswell as the sidewalls and upper surfaces of gates 76, 84 and 94. Inparticular, spacer insulator 88 is formed over the upper surface ofphotodiode 90. Spacer insulator 88 may be a layer of tetraethylorthosilicate (TEOS) formed by conventional deposition processes, forexample chemical vapor deposition (CVD). The spacer insulator depositionmay be an oxide, a nitride, a metal oxide, or a combination of thesematerials. Spacer insulator layer 88 may also be formed with aconformality of approximately 50% to 100%, and with a thickness in therange of about 100 to 2000 Angstroms, preferably from about 200 to about1000 Angstroms.

After spacer insulator 88 is formed, further doping can be performed,such as a surface P⁺ implant of photodiode 90 with a photoresist maskthat is then stripped.

FIG. 3 also shows a photoresist layer 104 deposited and patterned. Thephotodiode region 90 is covered with resist as are the p-channeltransistors 94. The N-channel transistors in the array 76, 84 and theN-channel transistors in the periphery 294 have had the resist removedin these regions as a result of light exposure and resist development.

It is to be understood that the scope of this invention is not to belimited by the examples shown in FIGS. 3-7, as to which regions aremasked. In FIG. 3, the photosensitive node 90 in portion 58 is shownprotected by photoresist 104 but the floating diffusion region 200 isshown with the resist removed. It is also possible to either partiallyor entirely cover the floating diffusion region 200 with photoresist104. If the contact 300 to the floating diffusion region 200 does nothave an N⁺ region below the contact 300, as shown in FIG. 8, then aSchottky contact is formed. The invention does not require a Schottkycontact on the floating diffusion region 200.

In another embodiment, it is possible to protect any or all of thecharge collecting nodes in the array, including the photosensor 90 andfloating diffusion region 200, and open up either or both of then-channel and p-channel regions in the periphery.

FIG. 4 illustrates a stage of processing subsequent to that shown inFIG. 3. At this stage, a first masked spacer etch is performed onexposed areas of spacer insulator 88 to form sidewall spacers 105. Inthis illustrated embodiment, etched sidewall spacers 105 are formed atan angle, such that the upper portion of spacers 105 are approximatelyaligned with the upper surfaces of gate structures 76, 84, and 294 butspacers 105 could have other shapes. Spacer formation is achieved by ananisotropic dry etch, which forms spacers 105 on sidewalls of gates 76,84, and 294. During this first masked spacer etch, photodiode 90 iscovered with a masking layer of the photoresist 104.

After formation of spacers 105, N⁺ doping is performed by ionimplantation. As shown in FIG. 5, heavily doped N⁺ type source/drainregions 108 and 110 have been implanted into substrate 70. Source/drainregions 108 and 110 may be implanted by any suitable method, includingion implantation of phosphorus, arsenic, antimony or any other N typedopant, at varying doses, for example, in the range of about 5×10¹⁴ to5×10¹⁶ atoms/cm² and an energy in the range of about 1 KeV to about 50KeV. After ion implantation, photoresist 104 can be stripped.

Gates 76, 84 and 294 and their sidewall spacers provide an implant maskfor the underlying portion of substrate 70. As a result, the boundariesof source/drain regions 108 and 110 may be substantially aligned withthe lateral edges of sidewall spacers 105.

After the N⁺ type source/drain implants, a photoresist layer 106 isdeposited and patterned, leaving a mask over the array of pixels, asshown in FIG. 5. The mask covers spacer oxide 88 formed over the entirephotodiode 90, and also covers gates 76, 84 and 294. Photoresist 106 isexposed, developed and therefore removed, however, in the peripherywhere P-channel gates 94 are located.

FIG. 6 depicts a stage of processing subsequent to that shown in FIG. 5.At this stage, a second masked spacer etch is performed on the spacerinsulator 88 in the P-channel periphery to form sidewall spacers 114.Spacer formation is achieved by an anisotropic dry etch, which formspacers 114 on both sidewalls of P-channel gates 94 in the periphery.During this second masked spacer etch, the photodiode 90 remains coveredwith photoresist 106.

After formation of spacers 114, P⁺ doping is performed. As illustratedin FIG. 7, heavily doped P⁺ type source/drain regions 118 and 120 areimplanted into substrate 70. Source/drain regions 118 and 120 may beimplanted with any suitable P-type dopant, for example boron,boron-difluoride, or indium, in any dose range, for example, in therange of about 5×10¹⁴ to about 5×10¹⁶ atoms/cm² and an energy in therange of about 1 to about 50 KeV.

Following the P type source/drain implants, photoresist layer 106 isremoved from over the array. An elevated-temperature drive step may alsobe performed, after which the N-channel and P-channel devices are fullyformed. The structure shown in FIG. 7 may also be covered with a numberof translucent or transparent insulating and passivation layers (notshown) formed over the CMOS image device. Such insulating andpassivation layers are typically SiO₂, BPSU, TEOS, BPSG, ILD, nitride,PSG, BSG, or SOG which can be planarized. Conventional processing stepsmay also be carried out to form, for example, contacts in the insulatinglayers to provide electrical connection with the implanted source/drainregions and other wiring to connect gate lines and other connections inthe pixel. The contact holes may be metallized to provide electricalcontact to a photogate, reset gate and transfer gate. Further layers mayprovide filters and lenses, such as with polymide. Other conventionalprocessing steps may also be carried out to complete the formation ofadditional components. The order of the process steps may be varied asis required or convenient for a particular process flow.

The structure illustrated in the embodiment in FIG. 7 provides spacerson the gates in the array and the periphery, and a layer of spacerinsulator 88 remains over photodiode 90.

It should be understood that the invention is applicable to providingphotodiodes 90 in many arrangements and orientation, and with manyshapes and geometry, to be integrated with other components of asemiconductor device. In accordance with one embodiment of theinvention, each pixel of a CMOS image device comprises a pinnedphotodiode for performing photoelectric conversion. In the case of aphotoconductor photosensor as an example of an overlying photosensor, itis understood that the sensitive area to be protected from the spaceretch is the corresponding region in the substrate where charge iscollected. The CMOS image sensor may optionally include a photogate,photoconductor, or other image to charge converting device, in lieu of aphotodiode, for initial accumulation of photo-generated charge.

The invention also applies to CCD imagers. The photosensitive nodeelement in the CCD imager can have improved performance, includingimproved dark current performance, by employing masked spacer etches.Spacers are formed in the periphery and in the array where needed whilethe photosensitive storage node(s) are masked.

The steps in processing after FIG. 7 are shown in FIG. 8. In FIG. 8, aninsulator 290, for example an undoped oxide, PSG, or BPSG, is depositedby CVD or spin-on techniques. The insulator may be planarized by resistetch-back or chemical mechanical planarization (CMP) techniques. Contactholes 300 are patterned and etched down to the diffusions and gates. Forsimplicity, only a few contacts are shown in FIG. 8 formed down to a fewselect diffusion regions. The contacts 300 are filled with metal such asTi/Al—Si—Cu or Ti/TiN/W, for example. The metal in the contacts 300 maybe removed from the top of the insulator using CMP techniques, forexample, or metal lines may then be patterned and etched. An exemplarycontact 300 formed down to floating diffusion node 200 is shown. Thefinal steps in completing the processing including forming metal lines,vias, passivation, and bond pad openings are well known.

FIG. 9 illustrates a block diagram of a CMOS imager device 808 having apixel array 800 containing a plurality of pixels arranged in rows andcolumns. The pixels of each row in array 800 are all turned on at thesame time by a row select line, and the pixels of each column areselectively output by respective column select lines. The row lines areselectively activated by a row driver 810 in response to row addressdecoder 820. The column select lines are selectively activated by acolumn selector 860 in response to column address decoder 870. The pixelarray is operated by the timing and control circuit 850, which controlsaddress decoders 820, 870 for selecting the appropriate row and columnlines for pixel signal readout. The pixel column signals, whichtypically include a pixel reset signal (V_(rst)) and a pixel imagesignal (V_(sig)), are read by a sample and hold circuit 861 associatedwith the column selector 860. A differential signal (V_(rst)-V_(sig)) isproduced by differential amplifier 862 for each pixel which is amplifiedand digitized by analog to digital converter 875 (ADC). The analog todigital converter 875 supplies the digitized pixel signals to an imageprocessor 880.

Imager device 808 is illustratively an integrated circuit. Pixel array800 includes portions of spacer material 88 over photosensors 90, asshown for one pixel, and the gates of N-channel transistors in pixelarray 800 have spacers that also include spacer material 88. Meanwhile,peripheral components including timing and control circuit 850, decoders820 and 870, drivers 810 and 860, sample and hold circuit 861, amplifier862, ADC 875, and processor 880 include N-channel and P-channel deviceswhose gates also have spacers that include spacer material 88.

While the above description relates to methods for forming CMOS imagerdevices using a dual masked spacer etch to achieve improved dark currentperformance by leaving spacer material over charge collection nodesincluding but not limited to the photosensor and the floating diffusionnode, and devices with spacer material over charge collection nodesincluding but not limited to the photosensors and the floating diffusionnode, one skilled in the art will recognize that the invention can beused to form other types of imager devices for integration with one ormore processing components in a semiconductor device. For example,various types of CMOS imager circuitry with different numbers oftransistors connected in various configurations could be used. CertainCMOS imagers include a storage node which may be advantageouslyprotected as per the invention. Also, the invention is not limited toCMOS imagers, and might be used in any suitable image sensor, forexample, CCD image sensors or imagers that include features of both CMOSand CCD imagers. The last (output) stage of a CCD image sensor, forexample, can provide sequential pixel signals as output signals using afloating diffusion node, source follower transistor, and reset gate in asimilar manner to the way these elements are used in the pixel of a CMOSimager. The CCD imager also contains photosensor regions such as aphotodiode, photogate, or photoconductor. The storage nodes associatedwith these photosensors may be advantageously protected using methodsdescribed herein for the invention. Accordingly, the techniquesdescribed above may be employed in CCD image sensors as well as CMOSimage sensors. The imager devices as described above may also be formedas different size megapixel imagers, for example imagers having arraysin the range of about 0.1 megapixels to about 20 megapixels.

It should again be noted that although the invention has been describedwith specific reference to producing imagers using a dual masked spaceretch, the invention has broader applicability. For example, the dualmasked spacer etch process described above is but one method of manythat may be used, including single masked spacer etches in which spacermaterial remains over sensitive array charge collection or storage nodeswhile spacers for gates of both periphery N-channel and peripheryP-channel and selectively chosen array N-channel devices are etched. Theabove description and drawings illustrate embodiments that achieveobjects, features and advantages of the present invention. Althoughcertain advantages and embodiments have been described above, thoseskilled in the art will recognize that substitutions, additions,deletions, modifications and/or other changes may be made withoutdeparting from the spirit or scope of the invention. Accordingly, theinvention is not limited by the foregoing description but is onlylimited by the scope of the appended claims.

1-68. (canceled)
 69. An imaging array comprising: at least one pixel,wherein the pixel is part of a CCD imager, comprising: a photosensitiveregion; a gate structure; a continuous layer of an insulating materialformed over the photosensitive region; and a spacer of the insulatingmaterial formed on at least one side of the gate structure. 70-71.(canceled)
 72. An integrated circuit with an imaging array comprising:at least one pixel, wherein the pixel is part of a CCD imager,comprising: a photosensitive region; a gate structure; a continuouslayer of an insulating material formed over the photosensitive region; aspacer of the insulating material formed on at least one side of thegate structure; and a peripheral circuit, said peripheral circuit havingat least one transistor with a second gate structure and a second spacerof the insulating material formed on at least one side of the secondgate structure.
 73. An imaging device comprising: a semiconductorsubstrate; and a pixel array, said pixel array comprising: at least onephotosensor, said photosensor covered by a continuous layer of spacermaterial; at least one N-channel transistor, wherein at least one spacerformed from said spacer material is along at least one side of at leastone of each said N-channel transistor's gate; and at least one of anN-channel transistor or a P-channel transistor outside said pixel array,wherein spacers formed from said spacer material are along at least oneside of at least one of either said P-channel or N-channel transistor'sgate.
 74. The imaging device of claim 73, further comprising atranslucent or transparent insulating layer formed over said imagingdevice, said insulating layer selected from the group consisting ofSiO₂, BPSU, TEOS, BPSG, PSG, BSG, and SOG.
 75. The imaging device ofclaim 74, wherein electrical contacts are formed through said insulatinglayer.
 76. An image pixel array in a CMOS imaging device, comprising: atleast one photosensor, said photosensor covered by a continuous layer ofspacer material; and at least one N-channel transistor having a gateand, along at least one side of the gate, a spacer formed of said spacermaterial.
 77. The image pixel array of claim 76, wherein saidphotosensor is selected from the group consisting of a photodiode,photogate, photoconductor, and other photon to charge converting devicefor initial accumulation of photo-generated charge.
 78. The image pixelarray of claim 76, wherein said spacer material comprises at least oneof an oxide, nitride, oxide/nitride, and metal oxide.
 79. The imagepixel array of claim 76, wherein said pixel array comprises about 0.1megapixels to about 20 megapixels.
 80. The image pixel array of claim76, wherein each pixel of said pixel array comprises a pinned photodiodefor performing photoelectric conversion.
 81. An imager system,comprising: a processor; and an imaging device connected to providesignals to said processor, said imaging device comprising: asemiconductor substrate; and a pixel array, said pixel array comprising:at least one photosensor, said photosensor covered by a continuous layerof spacer material; at least one N-channel transistor, wherein at leastone spacer formed from said spacer material is along at least one sideof at least one of each said N-channel transistor's gate; and at leastone N-channel or P-channel transistor outside said pixel array, whereinat least one spacer formed from said spacer material is along at leastone side of at least one of each said N-channel and P-channeltransistor's gate.
 82. The imager system of claim 81, wherein saidspacer material comprises at least one of an oxide, nitride,oxide/nitride, and metal oxide.
 83. (canceled)
 84. The imaging array ofclaim 69, wherein said gate structure is a transfer gate.
 85. Theimaging array of claim 69, wherein said gate structure is a reset gate.86. The imaging array of claim 69, wherein said gate structure is a rowselect gate.
 87. The imaging array of claim 69, wherein said gatestructure is a source follower gate.
 88. The integrated circuit of claim72, wherein said gate structure is a row select gate.
 89. The integratedcircuit of claim 72, wherein said gate structure is a source followergate.
 90. The integrated circuit of claim 72, wherein said gatestructure is a reset gate.
 91. The integrated circuit of claim 72,wherein said gate structure is a transfer gate.
 92. The integratedcircuit of claim 72, wherein said second gate structure is a sourcefollower gate.
 93. The integrated circuit of claim 72, wherein saidsecond gate structure is a reset gate.
 94. The integrated circuit ofclaim 72, wherein said second gate structure is a transfer gate.
 95. Theintegrated circuit of claim 72, wherein said second gate structure is arow select gate.